[Eng Sub] Die Attach Process: Paste type adhesive, Film type adhesive

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September 13, 2020
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Semicon Talk
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[Eng Sub] Die Attach Process: Paste type adhesive, Film type adhesive

Transcript

Hello everyone. Welcome to Semicon Talk. Today I’m gonna talk about die attach process. Die attach process is to attach die on substrate. And substrate can be leadframe, laminate substrate, ceramic substrate etc. The most popular die attach material is a paste type adhesive thanks to its convenience and performance. And it is also usually called as... Read More

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