[Eng Sub] Laser Dicing - Ablation

Transcript

Hello everyone, welcome to Semicon Talk! Today’s topic is laser dicing especially using ablation. We already discussed about wafer sawing with blade, then why we need laser dicing? Let’s check it out! In wafer dicing, there are 4 major methods. Blade dicing, laser dicing using ablation, stealth dicing, and plasma dicing. By the way, wafer dicing ... Read More