Decapping ICs (removing epoxy packaging from chips to expose the dies)

TL;DR

Decapping integrated circuits using nitric acid for die examination and probing.

Transcript

hey everyone I got interested in decapping integrated circuits which means dissolving away the epoxy package and exposing the die so that you can either see what the die looks like and figure out perhaps what the circuit is or just probe the die while it's the chip is you have power so let me show you how I did this initially I started just using a... Read More

Key Insights

• ❓ CNC milling ensures precise pocket creation for nitric acid etching.
• 🥵 Heating the nitric acid accelerates the epoxy dissolution process.
• ❓ Fuming nitric acid is preferred for efficient decapping of integrated circuits.
• 🐿️ Careful handling is necessary to avoid damaging the chip during decapping.
• 🏣 Visual inspection of the die post-decapping reveals bond wires and circuitry.
• 🐿️ Further experimentation with probing on decapped chips is a potential avenue.
• 👨‍🦳 Different types of nitric acid, such as red fuming and white fuming, offer varying concentrations for the decapping process.

Questions & Answers

Q: What is the purpose of decapping integrated circuits?

Decapping allows for visual inspection of the integrated circuit die and potential probing to understand the circuit's functionality or security features.

Q: Why is a CNC mill preferred over a Dremel for decapping?

A CNC mill provides precision in creating a uniform pocket for the acid etching process, ensuring accurate removal of the epoxy package.

Q: How does temperature affect the nitric acid etching process?

Heating the nitric acid accelerates the reaction, speeding up the epoxy dissolution and making the process more efficient for decapping integrated circuits.

Q: What are the differences between concentrated and fuming nitric acid?

Fuming nitric acid is closer to 100% concentration and is preferred for decapping due to its efficiency in dissolving the epoxy package of integrated circuits.

Summary & Key Takeaways

• Decapping involves dissolving epoxy to expose the integrated circuit die for examination.

• The process includes using a CNC mill for accuracy and nitric acid for etching.

• Nitric acid reacts faster at higher temperatures, revealing the die for analysis.