Japan enacts chip export controls at US behest - Asia Times
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23 specific types of semiconductor production equipment, including cleaning (three items), deposition (11 items), annealing (one item), lithography (four items), etching (three items) and inspection (one item). Extreme ultraviolet (EUV) lithography, nanoimprint lithography, photomasks, epitaxial waf
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- 23 specific types of semiconductor production equipment, including cleaning (three items), deposition (11 items), annealing (one item), lithography (four items), etching (three items) and inspection (one item).
- Extreme ultraviolet (EUV) lithography, nanoimprint lithography, photomasks, epitaxial wafers and high-speed valves are specifically mentioned,
- This equipment now falls into the category of items that can be used for military purposes, the export of which is regulated under Japan’s Foreign Exchange and Foreign Trade Control Law.
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